FormFactor and Teradyne collaborate on semiconductor testing
The collaboration targets HPC, advanced packaging, HBM and silicon photonics.
On October 12, 2026, FormFactor announced a technology collaboration with Teradyne covering device development, validation and volume-production readiness.
The companies plan to combine probing and interface expertise with automated test platforms. A proposed equity investment remains subject to closing conditions and regulatory approvals.
Source publication: FormFactor ↗